IEEE MEMS 2014 Conference -- January 26-30, 2014 -- San Francisco, USA

Exhibition

Current Support

Booth Availability

Exhibition Schedule

Exhibitor Prospectus

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SSEC
185 Gibraltar Road
Horsham, PA 19044 USA
phone: 1-267-965-7000
fax: 1-267-965-2828
email: eleroy@ssecusa.com
www.ssecusa.com

Booth 20

SSEC designs and develops its single wafer wet processing capabilities to remain on the leading edge of MEMS technology. Target market MEMS applications include metal lift-off, trench cleaning, thick film removal, metal etch and wafer thinning. All SSEC systems are engineered from the inside out and are configurable according to customer process needs and their manufacturing and business objectives.