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scia Systems provides advanced solutions for ion beam processing in thin film technology. The industry proven scia Trim 200 systems define the leading standard for frequency trimming of piezoelectric resonators (SAW, BAW). scia Systems addresses the entire spectrum from reactive ion beam etching to dual ion beam deposition. Both processes are applicable with special source arrangements on surfaces that accommodate standard wafer sizes. Additionally, scia Systems also designs flexible and modular systems combining several technologies like PECVD, PVD, IBE, RIE into cluster and in-line solutions according to customer specific requirements and applications.
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